4 Heat Pipe CPU Heat Sink for LGA2011 1366 11501151 1155 1156 Platform Cooling Kit

Item Type: 4 Heat Pipe CPU Heat Sink
Material: Aluminum alloy + copper tube
Fan Size: Approx. 9 x 9 x 2.5cm / 3.5 x 3.5 x 1in
Role: CPU heat dissipation

Features

1、With aluminum alloy double tower heat sink, large heat dissipation area.
2、Using 4 heat pipes, high heat dissipation efficiency and fast heat dissipation.
3、Using 9cm cooling fan, which with strong wind and strong heat dissipation.
4、Support temperature control, automatic speed regulation, convenient to use and with good performance.
5、With back plate and bracket, easy to install, suitable for LGA2011 1366 11501151 1155 1156 platform.

Package List

1 x Heat Sink

1 x Backplane

1 x Bracket

8 x Screws