7 Bottles Tin Solder Ball BGA Reballing Soldering Heat Universal Stencils for PCB Chip

Item Type: Tin Solder Ball
Material: Tin
Specifications: 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.6mm
Application: Tin balls are mainly used to connect semiconductor chips, circuit templates and PCB boards, and ultra small spherical tin electronic parts that transmit electronic signals

Features

1、DURABLE TIN MATERIAL: This solder ball is made of good quality tin material, stable, durable and can be used for a long time
2、CONNECT CHIPS AND PCB: These solder balls are used to connect semiconductor chips, circuit modules and PCB boards, provide great convenience
3、TRANSMIT SIGNALS FOR WELDING: Tin solder balls are very small, can transmit electronic signals, very useful for welding work
4、ENOUGH QUANTITY: Available in many different sizes, each bottle contains approximately 12,500 solder balls to meet your basic soldering needs
5、STABLE AND DURABLE: Tin solder ball for BGA reballing come with stable structure, excellent performance and long service life

Package List

7 Bottles of Tin Solder Ball