Universal BGA Reballing Stencil Multifunctional Tin Mesh Solder Template for Phone BGA IC Chips Repair

Item Type: BGA Reballing Stencil
Pitch: 0.3mm/0.012in, 0.35mm/0.014in, 0.4/0.016in, 0.5mm/0.020in
Product Material: Stainless Steel

Features

1、FOUR PITCHES: Universal BGA reballing stencil has three types of holes with 0.3 0.35 0.4 0.5 pitch, four kinds of spacing and multiple sizes.
2、PRECISE POSITIONING: Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
3、COMPACT APPEARANCE: Universal BGA reballing stencil has a compact appearance and is easy to carry around and use.
4、VERSATILE: BGA reballing stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
5、STAINLESS STEEL MATERIAL: Tin mesh solder template is made of premium stainless steel material, which is not easily damaged and has a long service life.

Package List

1 x BGA Reballing Stencil