Solder Balls BGA Reballing 0.55mm 250 Thousand Grains for Laptop Phone Repair

Item Type: Solder Balls
Product Composition: Sn63/(tin 63%)
Specification: Approx. 0.55mm / 0.02in 250,000 grains
Uses: Chip planting beads, ball planting
Scope of Application: BGA package soldering, filling, maintenance, ball planting
Features: Add trace elements to improve the oxidation ability and reliability of the solder ball pit.
Description:
The tin ball is mainly connected with the semiconductor chip, the circuit template and the PCB board, and the ultra-small ball-type tin electronic part that transmits the electronic signal.
Tin Ball Diameter for IC Packaging: Approx. 0.2 ~ 0.76mm / 0.01 ~ 0.03in

Features

1、Adding trace elements to the solder ball can improve the oxidation ability and reliability of the solder ball pit
2、Widely used in chip planting, connecting semiconductor wafers and circuit templates and PCB boards, and transmitting electronic signals with ultra‑small ball tin electronic parts, etc.
3、The solder with tin balls is more durable and can help you solder effectively
4、A large number, can meet your use and replacement needs, very practically
5、Use bottled pack and small size, easy to carry and store, convenient to use and with good performance

Package List

1 Bottle Solder Balls