12PCS BGA Solder Ball 0.2mm to 0.889mm Bottled Reballing Tin Solder Ball for Welding

Item Type: BGA Solder Ball
Material: Tin
Item Model Number: SAC305
Specifications: 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.64, 0.76, 0.889mm
Number of Particles: 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, 0.55, 0.6, 0.64mm for 25000Pcs, 0.76, 0.889mm for 10000Pcs
Melting Point: 218℃
Content: Sn96.5, Ag3, Cu0.5

Features

1、DIFFERENT SIZE: There are 12 different sizes for you to choose from, from 0.2mm to 0.889mm, to meet your needs.
2、SMALL BUT USEFUL: These solder balls are small but transmit electrical signals and are very useful for your soldering work.
3、TIN MATERIAL: These solder balls will not be oxidized by air at room temperature, and the oxidation will be accelerated under heating, which is very suitable for soldering.
4、SUFFICIENT QUANTITY: There are 10PCS bottles containing approximately 25,000 solder balls and 2PCS bottles containing 10,000 solder balls for your basic soldering needs.
5、MAIN APPLICATION: These solder balls are used for the connection of semiconductor chips, circuit modules and PCB boards.

Package List

12 Bottle x BGA Solder Ball