Product Overview
Features:
Good moisturizing, bright and full solder joint, little smoke, no irritating smell.
Less residual, high insulation resistance, high activity, strong welding force.
Easy to weld, can protect BGA traces from corrosion and moisture.
Good wetting, dry resistance, long shelf life at room temperature
Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.
Specification:
Viscosity: 200 (Pa. S)
Granularity: 24-45 (um)
Product size: 37 * 20mm / 1.5 * 0.8in
Alloy components: Sn63
Activity: high activity
Melting point: 183℃
Temperature: 220~380℃
Package List:
1 x Solder Paste
Good moisturizing, bright and full solder joint, little smoke, no irritating smell.
Less residual, high insulation resistance, high activity, strong welding force.
Easy to weld, can protect BGA traces from corrosion and moisture.
Good wetting, dry resistance, long shelf life at room temperature
Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.
Specification:
Viscosity: 200 (Pa. S)
Granularity: 24-45 (um)
Product size: 37 * 20mm / 1.5 * 0.8in
Alloy components: Sn63
Activity: high activity
Melting point: 183℃
Temperature: 220~380℃
Package List:
1 x Solder Paste
Features
1、Good moisturizing, bright and full solder joint, little smoke, no irritating smell.
2、Less residual, high insulation resistance, high activity, strong welding force.
3、Easy to weld, can protect BGA traces from corrosion and moisture.
4、Good wetting, dry resistance, long shelf life at room temperature
5、Used for high precision circuit board SMT welding, BGA process welding, CPU tin planting, etc.
Package Weight and Dimension
| Weight | 0.66 lb |
| Width | 1.56 Inch |
| Height | 1.17 Inch |
| Length | 1.95 Inch |
