MCN‑UV50 Paste Flux Soldering Tin Flux Electric Soldering Iron Flux for PCB / BGA / PGA / SMD

Description:
The paste flux is a butter-like ointment with high bonding
strength, neutral pH, strong insulation and smooth welding surface. It is
suitable for flux soldering in precision electronic product, PCB, BGA, etc.
 
Features:
1. High quality soldering flux with excellent performance. 
2. Use without concerns - not corrosive
to integrated circuit board.
3. Its boiling point is slightly higher than that of soldering tin.
4. Lightweight with small volume, easy and convenient to use.
5. Easy and durable soldering with this flux, as well as fast cleaning
and good insulation.
6. Ideal for flux soldering in precision electronic product, PCB, BGA,
etc.
 
Specifications:
Mode;: UV50
Color: Yellow
Viscosity: 0.2PaS
Granularity: 0.22um
Weight: Approx. 35g
Instructions:
1. Wipe the surface of the object before soldering.
2. Apply the paste flux to the solder joint.
3. Solder the tin to the solder joint with soldering iron.
 
Package List:
1 x Paste Flux

Features

1、High quality soldering flux with excellent performance.
2、Use without concerns – not corrosive to integrated circuit board.
3、Its boiling point is slightly higher than that of soldering tin.
4、Lightweight with small volume, easy and convenient to use.
5、Easy and durable soldering with this flux, as well as fast cleaning and good insulation.

Package List

1 x Paste Flux