Low Temperature Tin Solder Paste Strong Compounding Force BGA Use Flux Paste 158℃ for Repairing

Features

1、No False Solder: This solder paste can be soldered without false solder, and it has a strong compounding power with the soldering iron tip.
2、Easy to Use: With reasonable design and easy access, our solder paste can be applied directly in the process to improve efficiency.
3、Light Weight: Our solder paste is light weight and very portable, you can always take it with you when you need it.
4、Security in Usage: Enhances security in usage, can withstand greater work strength, improves performance, allows for an enhanced experience in usage.
5、Applicable Scenarios: Our solder paste is suitable for phone repairing, electronics industry, computers maintenance, etc.

Package List

1 x Tin Solder Paste