Product Overview
Material: Tin
Model: SFD-227
Composition: Sn96.5, Ag3, Cu0.5
Particles: 20-38μm
Weight: Approx. 45g/ 1.6oz piece with tube
Applicable: Mobile phone hard disk CPU IC, etc.
Melting Point: 217℃
Features
1、SOLDERING HELPER: Soldering paste can help and promote the soldering process in the soldering process, and at the same time have a protective effect and prevent oxidation.
2、CONTINUOUS PRINTING: This solder paste has strong continuous printing performance and is suitable for soldering of fine pitch ICs, BGAs and relatively precise components.
3、STABLE PERFORMANCE: This solder paste has good wettability and mold release, cold slump resistance, hot slump and dry resistance.
4、WELD FIRMLY: This tin paste is suitable for PCB soldering of various high demand materials, and there is little displacement of tin tombstones.
5、WIDE APPLICATION: Our soldering oil is suitable for chip IC, mobile phone motherboard and electrical maintenance and circuit soldering.
Package List
1 x High Temperature Solder Paste
Package Weight and Dimension
| Weight | 0.66 lb |
| Width | 4.68 Inch |
| Height | 0.78 Inch |
| Length | 5.07 Inch |
