Product Overview
Material: Solder Paste
Weight: Approx. 60g / 2.1oz
Alloy: Sn96.5, Ag3 Cu0.5
Particles: 20-38μm
Features
1、Wide Applications: Solder paste has extremely strong continuous printing performance, it is suitable for the welding of fine pitch ICC and BGA and relatively precise components, as well as household appliances and industrial equipment such as circuit boards, ICs, telephones, televisions, etc.
2、PCB Welding: High temperature solder paste is suitable for PCB welding of a variety of high requirements materials, fine spacing and high accracy components, and there is little displacement of tin connecting monument.
3、Good Faetures: The 217℃ melting point solder paste has good wettability, demoulding, cold collapse resistance, hot collapse resistance and dry resistance.
4、Reliable Performance: The top tin is full, bright tin beads, less residue, white and transparent, and free of extremely corrosive substances.
5、Commodity Parameters: Environment friendly high temperature solder paste, alloy is Sn96.5, Ag3, Cu0.5, 217 ℃ high melting point, net weight 60g.
Package List
1 x Solder Paste
Package Weight and Dimension
| Weight | 0.66 lb |
| Width | 1.56 Inch |
| Height | 1.17 Inch |
| Length | 1.56 Inch |
