Thermal Pad 13.8W/mK High Temperature Performance Insulativity Silicone Material GPU Thermal Pad120 X 20 X 0.5mm

Item Type: Thermal pad
Material: Silicone
Thermal Conductivity: 13.8W/mk
Density: 3.3±0.1
Hardness: 40-80Sc
Temperature Resistance Range: -40°~200℃
Compatible Devices: Laptops, Desktops

Features

1、[13.8W/mK Thermal Conductivity] Excellent thermal conductivity, upgraded thermal silicone material, with a thermal conductivity of 13.8W/mK, which greatly improves the heat transfer between electronic components and effectively cools the temperature within a few seconds.
2、[High Temperature Performance] Super reliable and durable, it will not melting at ‑40℃‑200℃ high temperature performance, nontoxic, odorless, anti corrosion, wear resistant, anti static, flame retardant, compression, good insulation, contact with any electrical traces Will not cause any kind of damage.
3、[Scope of Application] GPU thermal pad is a perfect substitute for traditional heat sink compound grease, suitable for electronic products, CPU, GPU, heat sink, power LED, computer host, notebook computer, LED IC SMD DIP and any cooling module.
4、[Voltage Regulation Module] Voltage regulation module for ASICS and for DSPs, high speed large storage drives high calorie for BGAs, high thermal conductivity modules.
5、[Wide Application] Thermal pad is used between notebook and desktop graphics card IC, CPU, motherboard north south bridge and heat sink, between hard disk and shell, cooling piece and chassis or chassis.

Package List

1 x Thermal pad