Thermal Pad 13.8w/mk Conductivity 30x30mm Good Insulation Heat Resistance Computer Thermal Pad30x30x2.0mm

Item Type: Thermal Pad
Material: Silicone
Thermal Conductivity: 13.8W/mk
Density: 3.3 ± 0.1
Hardness: 40-80Sc
Temperature Resistance Range: - 40℃- 200℃
Size:
Approx. 30 x 30 x 0.5mm / 1.2 x 1.2 x 0.02in
Approx.30 x 30 x 1.0mm / 1.2 x 1.2 x 0.04in
Approx. 30 x 30 x 1.5mm / 1.2 x 1.2 x 0.06in
Approx. 30 x 30 x 2.0mm / 1.2 x 1.2 x 0.08in
Approx. 30 x 30 x 2.5mm / 1.2 x 1.2 x 0.1in
Approx. 30 x 30 x 3.0mm / 1.2 x 1.2 x 0.12in
Compatible Devices: Laptop, Desktop

Features

1、Excellent Performance: Excellent thermal conductivity, upgraded thermal silica gel material, with a thermal conductivity of 13.8w/mk, which greatly improves the heat transfer between electronic components and effectively cools the temperature in a few seconds
2、Scope of Application: Suitable for electronic products, CPU, GPU, power LED, computer host, laptop, LED IC SMD dip and any cooling module
3、Good Insulation: High temperature performance at ‑ 40 ℃ ‑ 200 ℃ will not dissipate heat, non toxic, tasteless, anti corrosion, wear resistant, anti static, flame retardant, compression and good insulation. Contact with any electrical trace will not cause any form of damage
4、Embedded Module: Voltage regulation module for DSPs, high speed and large storage drive module with high heat BGAs and high heat conduction demand
5、Wide Range of Applications: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling parts and chassis or chassis

Package List

1 x Thermal Pad