Thermal Pad 13.8 W/mK Conductivity 90x60mm Good Insulation Heat Resistance Computer Thermal Pad90x60x1.5mm

Item Type: Thermal Pad
Material: Silicone
Thermal Conductivity: 13.8W/mk
Density: 3.3 ± 0.1
Hardness: 40-80Sc
Temperature Resistance Range: - 40℃- 200℃
Size: 
Approx.90 x 60 x 0.5mm / 3.5 x 2.4 x 0.02in
Approx.90 x 60 x 1.0mm / 3.5 x 2.4 x 0.04in
Approx. 90 x 60 x 1.5mm / 3.5 x 2.4 x 0.06in
Approx. 90 x 60 x 2.0mm / 3.5 x 2.4 x 0.08in
Approx. 90 x 60 x 2.5mm / 3.5 x 2.4 x 0.1in
Approx. 90 x 60 x 3.0mm / 3.5 x 2.4 x 0.12in
Compatible Devices: Laptop, Desktop

Features

1、Scope of Application: Suitable for electronic products, CPU, GPU, power LED, computer host, laptop, LED IC SMD dip and any cooling module
2、Excellent Performance: Upgraded thermal silica gel material, with a thermal conductivity of 13.8w/mk, which greatly improves the heat transfer between electronic components and effectively cools the temperature in a few seconds
3、Wide Range Applications: Used between notebook and desktop graphics card IC, CPU, hard disk and shell, cooling parts and chassis or chassis
4、Good Insulation: High temperature performance at ‑ 40 ℃ ‑ 200 ℃ will not dissipate heat, non toxic, tasteless, anti corrosion, wear resistant, anti static, flame retardant, compression and good insulation
5、Embedded Module: Voltage regulation module for DSPs, high speed and large storage drive module with high heat BGAs and high heat conduction demand

Package List

1 x Thermal Pad