Product Overview
Material: Silicone
Thermal Conductivity: 12W/mk
Density: 3.2g/cm
Hardness: 60-70Sc
Features
1、Insulation Protection: The heatsink cooling pad has good insulation and will not cause any kind of damage when touching any electrical traces
2、Thermal Conductivity: The heatsink cooling pad can effectively dissipate heat in real time for applicable accessories, with a thermal conductivity of 12W/mK
3、Heat Resistance: The thermal compound pad is harmless, odorless, with heat resistance, which will not damage in the range of ‑40°C to 200°C
4、Antistatic Performance : The thermal compound pad has corrosion resistance, abrasion resistance, antistatic and flame retardant properties and can be used with confidence
5、Scope of Application: The thermal pad is suitable for electronic products, CPU, GPU, power LED, computer mainframe, laptop, desktop and any cooling module
Package List
1 x Thermal Pad
Package Weight and Dimension
| Weight | 0.66 lb |
| Width | 5.85 Inch |
| Height | 0.39 Inch |
| Length | 8.58 Inch |